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利用VL020真空烧结炉,选用In焊料对半导体激光器芯片的焊接技术进行较为深入的研究,分别对焊接时气体保护、焊接前期芯片、热沉的处理、真空工艺过程压力的施加、夹具设计和烧结工艺曲线等因素进行实验分析。结果表明,以上参数对半导体激光器芯片的焊接均有显著的影响,在N2/H2体积分数为95%/5%气体的保护下,通过对夹具施加适当的静压力,In焊料与Au能够充分和快速润湿,实现较高的焊接质量。蔡司显微镜检测结果表明,采用焊接技术可以使半导体激光器芯片具有较低的空洞率,高达90%以上的焊透率,其焊接过程主要通过夹具装配完成,人为影响因素少,成品率高,并适用于小批量生产。
Using VL020 vacuum sintering furnace, choose In solder for semiconductor laser chip welding technology more in-depth study, respectively, on gas welding, welding pre-chip, heat sink treatment, vacuum process pressure application, fixture design and sintering process Curve and other factors for experimental analysis. The results show that the above parameters have a significant influence on the semiconductor laser chip soldering. Under the protection of 95% / 5% N2 / H2 gas, by applying appropriate static pressure to the fixture, the In solder and Au can fully and Quickly wetting to achieve high welding quality. Zeiss microscopy test results show that the use of welding technology can make the semiconductor laser chip has a lower cavity rate, up to 90% of the penetration rate, the welding process is mainly completed by the fixture assembly, human factors, high yield, and applicable Small batch production.