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7月7日,台积电南京12英寸晶圆厂暨设计服务中心将正式奠基开工。此次台积电南京厂的奠基,宣布全球领先的晶圆技术进入中国大陆,这也意味着国内集成电路产业的先进制程之战正式拉开。该晶圆厂规划的月产能为2万片12英寸晶圆,预计于2018年下半年开始生产16纳米制程,2019年规划产能全部达产。这是继联电、力晶之后台资赴大陆设立的第三个12英寸晶圆厂,也是台湾历年来对大陆最大的单一投资案。
July 7, TSMC Nanjing 12-inch wafer fab and design service center will be officially laid the foundation stone. The foundation of the TSMC Nanjing plant, announced the world’s leading wafer technology into mainland China, which also means that the domestic integrated circuit industry’s advanced process of war officially opened. The fab plans monthly production capacity of 20,000 12-inch wafers and is expected to begin production of 16-nanometer process in the second half of 2018. Production capacity will be fully planned in 2019. This is the third 12-inch fab set up by Taiwan’s capital after UMC and Powerchip, and the largest single investment in mainland China over the years.