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采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。基于焊点体系的势能数据 ,分析了片式元件的焊点间隙和贴片误差的自调整作用。结果表明 ,焊点间隙随焊点钎料量的增加而近似线性增加 ;焊点间隙和焊点钎料量的增加有助于贴片误差的自调整作用 ,并提出了焊点间隙的一种回归模型。
The potential energy governing equation of SnPb solder joints on the surface was used to simulate the three-dimensional solder joint morphology of chip RC3216. Based on the potential data of the solder joint system, the self-adjusting effect of the solder joint gap and the chip error of the chip component is analyzed. The results show that the solder joint clearance increases linearly with the increase of the amount of solder filler. The increase of solder joint clearance and soldering flux contributes to the self-adjusting effect of the solder joint error and proposes a solder joint clearance Regression model.