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一、前言单晶锗的粗磨、精磨和抛光工序,一直沿用金刚砂研磨及散粒磨料抛光的传统工艺。其工艺特点是,无论粗磨、精磨、抛光,磨料和抛光粉均以散粒状态存在于模盘和工件之间,通常称为散粒磨料加工方法。虽然,这种方法也能加工出好的工件,但效率低,磨料利用率不高,模盘变形快。随着红外和半导体器件的发展,单晶锗元件的需求量日益增加,传统的加工方法已不适
First, the preface Single crystal germanium rough grinding, grinding and polishing process, has been followed by emery grinding and abrasive polishing conventional technology. The process is characterized by, regardless of roughing, grinding, polishing, abrasive and polishing powder are present in the form of particles between the mold plate and the workpiece, usually referred to as abrasive abrasive processing method. Although, this method can also produce good workpieces, but low efficiency, abrasive utilization is not high, deformation of the mold plate fast. With the development of infrared and semiconductor devices, the demand of single crystal germanium components is increasing day by day, and the traditional processing methods are not suitable