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NH3-plasma treatment is used to improve the quality of the gate dielectric and interface.Al2O3 is adopted as a buffer layer between HfO2 and MoS2 to decrease the interface-state density.Four groups of MOS capacitors and back-gate transistors with different gate dielectrics are fabricated and their C-V and I-V characteristics are compared.It is found that the Al2O3/HfO2 back-gate transistor with NH3-plasma treatment shows the best electrical performance:high on-off current ratio of 1.53 × 107,higher field-effect mobility of 26.51 cm2/V.s,and lower subthreshold swing of 145 mV/dec.These are attributed to the improvements of the gate dielectric and interface qualities by the NH3-plasma treatment and the addition of Al2O3 as a buffer layer.