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微光机电系统(MOEMS)是当今技术领域的研究热点之一,无论在军事和商业领域都有广泛的应用。当前MOEMS的制作主要利用二维平面技术,由于二维平面制作技术已经接近物理极限,进一步在二维平面上提高器件密度的难度变得越来越大,充分利用三维空间提高器件的密度有很多优点。本文介绍一种利用晶格失配的外延层自组装制作三维微纳米结构的方法,利用这种办法可以很方便地制作三维微纳米元件,并且在同一个衬底上进行自组装。
Micro-Electro-Mechanical Systems (MOEMS) is one of the hot topics in the field of technology today, and it has a wide range of applications in military and commercial fields. At present, the fabrication of MOEMS mainly utilizes two-dimensional planar technology. Since the two-dimensional planar fabrication technology is close to the physical limit, it is more and more difficult to further increase the density of the device in the two-dimensional plane. Making full use of the three-dimensional space increases the density of the device advantage. In this paper, we introduce a method to fabricate three-dimensional micro-nano structure by self-assembly using epitaxial layer of lattice mismatch. By this method, we can easily fabricate three-dimensional micro-nano devices and self-assemble on the same substrate.