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引言:化学沉铜是印制板生产中极为重要的一环。沉铜层的质量直接影响着印制板的质量。以前我们公司的印制板生产从沉铜前处理到沉铜一直采用手工操作,工人劳动强度大,工艺参数不易控制,使得印制板质量难以保证。为了改变这种状况,我们通过一年的时间,研制出了一条自动沉铜生产线。它将沉铜前处理和沉铜工艺融为一体,既提高了效率,又改善了印制板质量。本文就该系统的组成和电控原理作一简单介绍。
Introduction: Electroless copper plating is an extremely important part in the production of PCBs. The quality of the copper layer directly affects the quality of the printed board. In the past, our company’s PCB production from Shen copper pretreatment to sink copper has been the manual operation, workers labor-intensive, difficult to control the process parameters, making the quality of the printed board is difficult to guarantee. In order to change this situation, we developed through a year’s time an automatic copper sinking production line. It will sink copper pre-treatment and sinking copper technology integration, both to improve efficiency, but also improve the quality of printed circuit board. This article on the system composition and electronic control principle to make a brief introduction.