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为满足现代电子工业日益增长的散热需求,急需研究和开发新型高导热陶瓷(玻璃)基复合材料,而改善复合材料中增强相与基体的界面结合状况是提高复合材料热导率的重要途径.本文在对金刚石和镀Cr金刚石进行镀Cu和控制氧化的基础上,利用放电等离子烧结方法制备了不同的金刚石增强玻璃基复合材料,并观察了其微观形貌和界面结合状况,测定了复合材料的热导率.实验结果表明:复合材料中金刚石颗粒均匀分布于玻璃基体中,Cu/金刚石界面和Cr/Cu界面分别是两种复合材料中结合最弱的界面;复合材料的热导率随着金刚石体积分数的增加而增加;金刚石/玻璃复合材料的热导率随着镀Cu层厚度的增加而降低,由于镀Cr层实现了与金刚石的化学结合以及Cr在Cu层中的扩散,镀Cr金刚石/玻璃复合材料的热导率随着镀Cu层厚度的增加而增加.当金刚石粒径为100μm、体积分数为70%及镀Cu层厚度为约1.59μm时,复合材料的热导率最高达到约91.0 W·m-1·K-1.
In order to meet the increasing demand of heat dissipation in the modern electronics industry, it is urgent to research and develop new high thermal conductive ceramic (glass) matrix composites. Improving the interfacial bonding between reinforcing phase and matrix in composites is an important way to improve the thermal conductivity of composites. In this paper, different diamond-reinforced glass matrix composites were prepared by spark plasma sintering and their morphology and interfacial bonding were investigated by Cu-plating and Cr-controlled oxidation of diamond. The results show that the diamond particles in the composite material are uniformly distributed in the glass matrix and the Cu / diamond interface and the Cr / Cu interface are the weakest interfaces of the two composites respectively. The thermal conductivity of the composites The thermal conductivity of the diamond / glass composite decreases with the increase of the thickness of the Cu-plated layer. Since the Cr-plated layer achieves the chemical combination with the diamond and the diffusion of Cr in the Cu layer, The thermal conductivity of Cr diamond / glass composites increases with the thickness of Cu plated layer.When the diamond particle size is 100μm and the volume fraction is 7 The thermal conductivity of the composites reaches up to about 91.0 W · m-1 · K-1 when the thickness of the Cu layer is about 1.59μm.