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Removing photoresist that has been heavily im-planted by one or more species continues to be acritical process step in the Front-End-of-Line pro-cess flow. With a plasma strip system that is ca-pable of processing wafers with multiple tempera-ture steps, variable ramp rates, and flexible plasmachemistries, processes can be optimized to achievea high degree of wafer cleanliness of heavily im-planted resist strip without damaging the underly-ing substrate material. An effective dry strip pro-cess will enable the significant reduction of post-strip wet cleans, which can reduce the overall pro-cess cost-of-ownership.
Removing photoresist that has been heavily im-planted by one or more species continues to be acritical process step in the Front-End-of-Line pro-cess flow. With a plasma strip system that is ca-pable of processing wafers with multiple tempera -ture steps, variable ramp rates, and flexible plasmachemistries, processes can be optimized to achieve high degree of wafer cleanliness of heavily im-planted resist strip without damaging the underly-ing substrate material. An effective dry strip pro-cess will enable the significant reduction of post-strip wet cleans, which can reduce the overall pro-cess cost-of-ownership.