论文部分内容阅读
本文用AES和XPS的表面分析和深度剥离技术研究了“催化金属”诱发时间不同时,基体铜表面上镍、铜、磷等元素含量的变化及其深度分布。结果表明,在化学镀镍层中存在薄的吸附层,它由C、Cl、O、S等组成,主要的吸附物是C和O。吸附层下面是正常的化学镀镍层,它的Ni/P比约为2。在靠近基体金属表面存在Ni/P比变化的交界层。最后是Ni、P扩散到基体铜上的Cu-Ni-P合金层,它们的Cu∶Ni∶P≈56∶36∶5,这是化学镀镍层与基体金属结合力特别好的原因。用铁诱发0.5s的铜片上用AES未检出铁,却检出了大量镍,而且铜的主要AES峰已为镍取代,表明诱发反应是典型的“一触即发”反应。AES未能检出铁,表明诱发反应不是诱发金属先在基体金属上沉积而后发生的。
In this paper, the surface analysis and depth-stripping techniques of AES and XPS were used to study the variation and depth distribution of nickel, copper, phosphorus and other elements on the surface of copper substrate when the “catalysis metal” induction time was different. The results show that in the electroless nickel layer there is a thin adsorbed layer, which consists of C, Cl, O, S and other components, the main adsorbates are C and O. Below the adsorption layer is a normal electroless nickel layer with a Ni / P ratio of about 2. In the vicinity of the base metal surface there Ni / P ratio of the change in the interface layer. Finally, Ni, P diffused to the base copper Cu-Ni-P alloy layer, their Cu: Ni: P ≈ 56:36:5, which is the reason why the electroless nickel layer and the base metal bonding force is particularly good. The absence of iron detected by AES with 0.5s on iron showed a large amount of nickel, and the main AES peak of copper was replaced by nickel, indicating that the evoked reaction was a typical “one shot” reaction. AES failed to detect iron, suggesting that the evoked reaction did not occur after the induced metal was first deposited on the base metal.