Interfacial reaction and growth behavior of reaction layer of Si_3N_4/Si_3N_4 joint brazed by Cu-Zn-

• 作 者: 张杰 周玉 M.Naka
• 机 构: School of Materials Science and Engineering Harbin Institute of Technology Harbin 150001 China,Scho
• 出 处: Transactions of Nonferrous Metals Society of China
• 发表日期: 2005年S2期
• 关键词: filler ceramic ceram EPMA

Si_3N_4 ceramic was jointed to itself using a filler alloy of Cu-Zn-Ti by the reaction between Ti and Si_3N_4. The microstructure of the interface in the joint is found to be Si_3N_4 ceramic/TiN reaction layer/Ti_5Si_3 reaction layer. The grain size of the TiN and Ti_5Si_3 reaction layer is 0.1μm and 1-2μm, respectively. There is no crystal orientation relationship between TiN reaction layer and Si_3N_4 ceramic or Ti_5Si_3 reaction layer. The kinetic equation for calculating the thickness of the reaction layer was obtained. When a (CuZn)85Ti15 alloy is used as the filler alloy, the apparent activation energy of the growth of the reaction layer is 201.69kJ/mol.

Si_3N_4 ceramic was joined to itself using a filler alloy of Cu-Zn-Ti by the reaction between Ti and Si_3N_4. The microstructure of the interface in the joint was found to be Si_3N_4 ceramic / TiN reaction layer / Ti_5Si_3 reaction layer. The grain size of the TiN and Ti_5Si_3 reaction layer is 0.1 μm and 1-2 μm, respectively. There is no crystal orientation relationship between TiN reaction layer and Si_3N_4 ceramic or Ti_5Si_3 reaction layer. The kinetic equation for calculating the thickness of the reaction layer was When a (CuZn) 85Ti15 alloy is used as the filler alloy, the apparent activation energy of the growth of the reaction layer is 201.69kJ / mol.