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在硫代硫酸盐体系(无氰)下电沉积制备了银纳米膜,研究了电流密度对电沉积银纳米膜的电流效率、结合强度、微观形貌、晶粒尺寸、织构及显微硬度的影响。镀液组成为:硝酸银44g/L,硫代硫酸钠220g/L,焦亚硫酸钾44g/L,醋酸铵30g/L,硫代氨基脲0.8g/L。结果表明:在电流密度为0.20～0.35A/dm2时,镀层与基体结合良好,电流效率随电流密度的增大而先增加再减小,(111)晶面的择优取向程度逐渐减弱,(222)晶面织构增强,晶粒尺寸略有增加,显微硬度稍有减小。
The silver nanofilms were electrodeposited in the thiosulfate system (without cyanide). The effects of current density on the current efficiency, bonding strength, microstructure, grain size, texture and microhardness of the electrodeposited silver nanofilms were studied. Impact. The bath composition is as follows: silver nitrate 44g / L, sodium thiosulfate 220g / L, potassium metabisulfite 44g / L, ammonium acetate 30g / L, thiosemicarbazide 0.8g / L. The results show that when the current density is 0.20 ~ 0.35 A / dm2, the bonding between the coating and the substrate is good. The current efficiency first increases and then decreases with the increase of the current density, and the (111) ) Grain surface texture enhancement, a slight increase in grain size, a slight decrease in microhardness.