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引言用作装配和电器件内部连接的热压焊已广泛地用于集成电路和薄膜技术。这种工艺过程的优点对石英晶体器件的制造是引人注意的,其优点是可靠、清洁、成本低、能高温处理,而且不受操作人员技术水平的限制。这种固相焊接工艺的应用是从5MHz5次泛音的精密石英晶体器件开始的,现在已扩展到单片晶体滤
INTRODUCTION Thermocompression bonding for internal connections to assemblies and electrical components has found widespread use in integrated circuit and thin film technologies. The advantages of this process are compelling for the manufacture of quartz crystal devices, which have the advantages of reliability, cleanliness, low cost, high temperature handling and are not subject to the technical skill of the operator. The application of this solid-state soldering process started with a 5MHz 5th overtone precision quartz crystal device and has now been extended to monolithic crystal filters