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应用Designer与HFSS联合仿真技术研究激光焊接工艺对连接性能的影响。首先,在HFSS中建立一个标准的BGA焊点模型,通过改变其尺寸参数仿真,得到使回波损耗最小的参数组合;随后,在Designer中建立激光模型,把HFSS中的焊接连接工艺模型以N端口元件的形式嵌入到Designer建立的激光中,进行联合仿真;最后,对嵌入焊接连接工艺前后的仿真结果进行对比分析,得出焊点及焊点尺寸的改变对激光性能的影响。在高频段,随着焊点高度的增加,焊点的回波损耗随之减小,当焊点高度为0.50 mm时,回波损耗最小,因而应优先选择0.50 mm的焊点高度。
Application of Designer and HFSS co-simulation technology to study the impact of laser welding process on the connection performance. First of all, a standard BGA solder joint model was established in HFSS, and the parameter combination that minimized the return loss was obtained by changing its size parameter simulation. Then, the laser model was established in Designer, and the welding connection process model in HFSS was expressed as N The port element is embedded in the laser established by Designer, and the joint simulation is carried out. Finally, the simulation results before and after the embedded welding connection process are compared and analyzed, and the influence of the change of the solder joint and the solder joint size on the laser performance is obtained. At high frequencies, the return loss of the solder joint decreases as the solder joint height increases. When the solder joint height is 0.50 mm, the return loss is minimized, so a solder joint height of 0.50 mm should be given preference.