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以醇盐水解-氨气氮化法在SiC颗粒表面包覆TiN,然后采用放电等离子体烧结进行致密化,重点分析所制备的(SiC)TiN/Cu复合材料的热物理性能和焊接性能。结果表明:醇盐水解-氨气氮化法能够制备出TiN包覆SiC复合粉末,TiN包覆层均匀连续,能够提高材料的致密度并改善界面结合。(SiC)TiN/Cu复合材料的热膨胀系数介于8.1×10-6～11.9×10-6K-1之间,并且随着SiC体积分数的增加而降低。(SiC)TiC/Cu复合材料经过8次热循环以后的残余塑性应变为4.0×10-4。当SiC的体积分数为30%时,复合材料的热导率达到270W·m-1·K-1。Ag-Cu-Ti钎料在900℃时能在(SiC)TiN/Cu复合材料上完全铺展,具有良好的润湿性。(SiC)TiN/Cu复合材料与Ag-Cu-Ti钎料焊接接头的剪切强度高达56MPa。
TiN was coated on SiC particles by alkoxide hydrolysis-ammonia gas nitriding method, and then densified by spark plasma sintering. The thermal physical properties and welding properties of (SiC) TiN / Cu composites were analyzed emphatically. The results show that the alkoxide hydrolysis - ammonia gas nitriding method can prepare TiN coated SiC composite powder with uniform and continuous TiN coating, which can improve the density and improve the interfacial bonding. The thermal expansion coefficient of (SiC) TiN / Cu composites ranged from 8.1 × 10-6 to 11.9 × 10-6K-1, and decreased with increasing SiC volume fraction. (SiC) TiC / Cu composites after 8 cycles of thermal residual plastic strain of 4.0 × 10-4. When the volume fraction of SiC is 30%, the thermal conductivity of the composite reaches 270W · m-1 · K-1. Ag-Cu-Ti solder can fully spread on (SiC) TiN / Cu composites at 900 ℃ with good wettability. (SiC) TiN / Cu composites and Ag-Cu-Ti solder brazing filler metal shear strength up to 56MPa.