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用扫描电镜能谱分析半定量和定量测定,经不同热处理工艺的Ag-Cu、Ag-H_(62)冷复合和磁控溅射复合电接点材料界面的成分分布,计算了扩散系数激活能实验表明,材料复合界面是金属键结合。
SEM and SEM were used to analyze the semi-quantitative and quantitative determination of the diffusion coefficient activation energy by the composition distribution of Ag-Cu, Ag-H_ (62) cold-composites and magnetron sputtering interface materials of different heat treatment process Show that the material composite interface is a metal bond.