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种种迹象表明整个电子行业已经摆脱了历史上最严重的衰退,正在稳步回升。历史的经验告诉我们,每次增长的背后往往伴随着某种技术的兴起。过去的几年可以说是 SoC 的时代,人们都在考虑将更多的功能集成在一个单芯片中,并且实现更小的尺寸、更低的功耗。这种技术思路直接导致了在 EDA 工具、制造与封装测试技术,以及 IP 核交易领域革命性的变革。但在 SoC 技术发展的同时,也一直有一个困扰着它的问题:我们究竟应该把多少东西集成在一起?更复杂
There are indications that the entire electronics industry has shrugged off the worst recession in history and is picking up steadily. Historical experience tells us that behind every growth is often accompanied by the rise of a certain technology. The past few years can be said that the era of SoCs, people are considering more functions integrated in a single chip, and to achieve smaller size, lower power consumption. This technical thinking led directly to the revolutionary changes in EDA tools, manufacturing and packaging test technology, and IP core transactions. But along with SoC technology, there has always been a bothering question: How many things should we integrate together? More complex