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本文分析了利用红外热象仪检测SOI片内部空隙、缺陷和脱粘的检测原理,介绍了测试仪器和测试方法,分析了测试结果.
In this paper, the detection principle of detecting the internal voids, defects and debonding in SOI sheet by using infrared thermal imager is introduced. The testing instruments and testing methods are introduced and the test results are analyzed.