论文部分内容阅读
3DD300大功率晶体管是工作在大电流容量下的,因此要求电极和内引线能够承受足够大的电流,否则可靠性、抗烧毁性将成为问题,从而不能输出其最大功率。我们开始是采用蒸铝,硅铝丝(ψ120微米)超声键合工艺,用户反应有烧毁、断线等现象,使用起来很不可靠。为适应用户的要求以及为制造功率更大的晶体管打下基础,我们将蒸铝、键合硅铝丝工艺改为镀镍挂锡引线焊接工艺。实践证明:在改革后,不但抗烧毁能力和一次击穿耐量有了很大改善,而且成品率也大有提高。
3DD300 high-power transistor is operating at high current capacity, thus requiring the electrode and the inner lead can withstand a large enough current, or reliability, anti-burnability will become a problem, which can not output its maximum power. We started with the use of steamed aluminum, silicon aluminum wire (ψ120 micron) ultrasonic bonding process, the user reaction has burned, broken and so on, the use of it is not reliable. In order to meet the requirements of users and lay the foundation for the manufacture of more powerful transistors, we changed the process of steamed aluminum and bonded silicon aluminum wire to nickel-plated tin-plated lead wire. Practice has proved that: after the reform, not only anti-burn ability and a breakdown tolerance has been greatly improved, and the yield has also greatly improved.