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IDM公司,芯片代工厂和封装厂正在致力于研发穿透硅通孔技术,但是目前来看,为了能够进一步控制生产成本还有大量的工作需要完成。
IDM companies, foundries and packaging houses are working on silicon-through-vias (TSVs), but so far there is a lot of work to be done to further control production costs.