Bond strength of W-Cu/CuCr integrated material

• 作 者: 范志康\\r\\r\\r\\r\\r\\r\\r\\r\\r\\n 梁淑华\\r\\r\\r\\r\\r\\r\\r\\r\\r\\n 薛旭
• 出 处: Transactions of Nonferrous Metals Society of China
• 发表日期: 2001年06期

The bond strength of W Cu/CuCr integrated material was investigated. The results show that the fracture of W Cu/CuCr integrated material often takes place at W Cu/CuCr interface. Some alloying elements enhance the bond of W and CuCr alloy, which results in the increase of the strength of the W Cu/CuCr interface. And the fracture of the W Cu/CuCr integrated material occurs in the CuCr alloy part, not at the W Cu/CuCr interface. Chromium in CuCr alloy part of the integrated material can improve Cr diffusing from the CuCr alloy to W Cu composite and can be alloyed (near the W Cu/CuCr interface) in the W Cu composite. Thus the strength of W Cu/CuCr interface is also increased.

The results show that the fracture of W Cu / CuCr integrated material often takes place at W Cu / CuCr interface. Some alloying elements enhance the bond of W and CuCr alloy, which results In the increase of the strength of the W Cu / CuCr interface. And the fracture of the W Cu / CuCr integrated material occurs in the CuCr alloy part, not at the W Cu / CuCr interface. Chromium in CuCr alloy part of the integrated material CuCu interface can also be alloyed (near the W Cu / CuCr interface) in the W Cu composite. Thus the strength of Cu Cu / CuCr interface is also increased.