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本文介绍了一种新型RP技术—激光内切割技术。这种技术由于它自身的特性会引起光束在材料内部传输时产生自聚焦效应 ,从而影响激光内切割的切割质量。这种影响可以通过对数控程序中机床步距进行修正来削弱或者消除。
This article describes a new RP technology - laser inner cutting technology. This technique, due to its own characteristics, can cause a self-focusing effect as the beam travels inside the material, affecting the quality of the cut within the laser. This effect can be mitigated or eliminated by correcting the machine step in the NC program.