论文部分内容阅读
利用硅基氧化铝模板制备出具有较大物理接触面积的嵌入式A1/Ni纳米复合材料。首先,在0.3M草酸、40V条件下通过阳极氧化技术制备硅基多孔氧化铝薄膜;其次,以多孔氧化铝薄膜为模板电沉积制备Ni纳米棒;最后,在Ni纳米棒表面溅射一层Al膜形成嵌入式结构。采用场发射扫描电镜(FESEM)清晰地描述了嵌入式Al/Ni纳米复合材料的形成过程,并且X射线能谱衍射(EDS)谱图记录了制备过程中不同阶段样品元素组成的变化。X射线衍射(XRD)谱图表明制备的Ni纳米棒为多晶结构,DSC测试结果显示嵌入式Al/Ni纳米复合材料具有良好的热反应活性,在微热源和起爆装置中有潜在的应用价值。由于嵌入式Al/Ni纳米复合材料与硅基相兼容,因而可集成到MEMS器件中。
Embedded Al / Ni nanocomposites with large physical contact area were prepared by using Si-based alumina template. Firstly, a porous silicon oxide film was prepared by anodic oxidation under 0.3M oxalic acid and 40V conditions. Secondly, Ni nano-rods were prepared by electrodeposition of porous alumina film. Finally, a layer of Al The film forms an embedded structure. The formation process of embedded Al / Ni nanocomposites was clearly described by field emission scanning electron microscopy (FESEM), and the X-ray energy dispersive spectroscopy (EDS) spectra recorded the changes of elemental composition of samples during different stages of preparation. The X-ray diffraction (XRD) spectra show that the prepared Ni nanorods have a polycrystalline structure, and the DSC test results show that the embedded Al / Ni nanocomposites have good thermal reactivity, and have potential applications in micro-heat sources and detonators . Embedded Al / Ni nanocomposites can be integrated into MEMS devices because they are compatible with silicon.