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一、目的(略) 二、技术说明 1.引言合同的第二阶段继续做两方面工作:首先进行L-10设计加工并开始投第一批片子;其次继续进行SB-4000片的工艺串联。 2.L-10掩模版图1(略)是设计的L-10器件;此图为第一阶段工作所制。加工这套掩模版所需要的时间大约六周。因此在本阶段的中途才拿到掩模版。多层外延材料已预先订货,几乎和掩模版同时拿到。这批硅材料的样品所呈现的扩展电阻样品(SRP)数据表明(图2),许多材料由于电阻率或各层厚度不合适而没被采用。图2示出了未被采用的材料
First, the purpose of (omitted) Second, the technical description 1. Introduction The second phase of the contract to continue to do two aspects: first L-10 design and processing and start casting the first film; followed by continuing SB-4000 chip technology series. 2. L-10 mask Figure 1 (omitted) is the design of the L-10 devices; This figure is made for the first phase of work. The time required to process this reticle is about six weeks. So in the middle of this stage to get the reticle. Multi-layer epitaxial materials have been pre-ordered, almost at the same time with the reticle to get. Expanded resistance sample (SRP) data presented by the samples of these silicon materials show (Figure 2) that many materials are not used because of resistivity or unsuitable thickness of each layer. Figure 2 shows the unused material