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传统上厚膜电容的制备由于采用了丝网技术、烧结工艺、有限的匹配温度特性材料,使得要实现高容量、低损耗、高频性就必须同时改变材料的成分、制备工艺和技术,这是无法同时达到的。而采用激光微细熔覆快速原型制造技术,不需要高温烧结和掩模的制备,在不改变电极膜特性的情况下直接制备了适应高容量、低损耗和高频应用的介质膜。同时,消除了原有技术通过多次印刷和增加厚度来减少针孔的弊端,以及高温烧结带来的电极材料和介质材料成分的扩散,利用CAD/CAM系统可灵活地制备所设计的图形和尺寸,实现了元件小型化、轻薄化的制造。
Traditionally, thick film capacitors have been fabricated using screen technology, sintering process, and limited matching of temperature characteristics to make it necessary to simultaneously change the composition, the manufacturing process and the technology of the material in order to achieve high capacity, low loss and high frequency. Can not be achieved at the same time. The use of laser cladding rapid prototyping manufacturing technology, does not require high-temperature sintering and mask preparation, without changing the characteristics of the electrode film directly prepared to adapt to high-capacity, low loss and high frequency dielectric film. At the same time, the disadvantages of the prior art that the pin holes are reduced by multiple printing and increasing the thickness and the diffusion of the electrode materials and the dielectric material components brought by the high-temperature sintering are eliminated. The CAD / CAM system can flexibly prepare the designed graphics and Size, to achieve the components of small, light manufacturing.