论文部分内容阅读
用Cu-Ti活性钎料对Al2O3陶瓷/碳钢实施钎焊,用透射电镜、扫描电镜、能谱仪和X射线衍射仪对界面微观结构进行表征,研究了钎焊温度1050℃、不同保温时间(10~40 min)对接头界面微观结构和剪切强度的影响。结果表明,保温30 min得到的钎焊接头具有较好的界面组织形态和较高的剪切强度。在此工艺条件下界面结合区有3层组成,即近陶瓷侧以Ti4Fe2O为主的反应层,近钢侧以Ti Fe2为主要析出相的扩散层,在反应层和扩散层之间为Cu固溶体+Ti4Fe2O相,各层组织比较致密,微孔缺陷较少,接头剪切强度达到99 MPa。
The Cu-Ti active brazing filler metal was used to braze Al2O3 ceramic / carbon steel. The microstructure of the interface was characterized by transmission electron microscopy, scanning electron microscopy, energy dispersive spectroscopy and X-ray diffractometer. The effects of brazing temperature 1050 ℃, (10 ~ 40 min) on the interface microstructure and shear strength. The results show that the brazed joints obtained after heat preservation for 30 min have better interfacial morphology and higher shear strength. Under this process condition, there are three layers in the interface junction, that is, Ti4Fe2O-based reaction layer near the ceramic side, TiFe2-based diffusion layer near the steel side, and Cu solid solution between the reaction layer and the diffusion layer + Ti4Fe2O phase, the structure of each layer is relatively dense, less microporous defects, joint shear strength of 99 MPa.