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有机硅化合物HMDSN用高频辉光放电方法进行等离子体聚合,使用频率为5.4 M.C.;输入最大功率为100W;基片温度为150℃。在不同性质的基片上可形成透明和致密的聚合膜。聚合膜具有优良的耐磨性和化学稳定性。红外吸收光谱表明HMDSN单体和其聚合膜的结构有着明显的不同。聚合膜的红外吸光谱较之单体的吸收峰少而且平坦,表示了聚合膜的基团少。聚合度高,其网状结构较为整齐。
The organosilicon compound HMDSN was plasma polymerized by a high-frequency glow discharge method using a frequency of 5.4 M.C .; a maximum input power of 100 W; and a substrate temperature of 150C. Transparent and dense polymeric films can be formed on substrates of different properties. Polymeric film has excellent wear resistance and chemical stability. Infrared absorption spectroscopy shows that there is a clear difference in the structure of the HMDSN monomer and its polymeric membrane. The infrared absorption spectrum of the polymeric film is less and more flat than that of the monomer, indicating that there are few groups of the polymeric film. High degree of polymerization, the network structure is more neat.