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随着表面组装以及电子元器件的微型化和密集化程度增加,对内部互连导线微细化以及高质量高性能程度的要求日渐严格,而传统技术越来越不能满足这种快速发展的需求。采用激光微细熔覆柔性直写技术,在玻璃基板上直接制备高质量高性能的微细导带。通过控制各工艺参数的变化所引起组织形貌的变化判定形成导带的性能的好坏和质量的优劣,优化了工艺参数,并采用该参数进行实际图形的制备。结果表明,所制备的导带导电性好、结合强度高、焊接性好、表面平整度高,适合于产品的智能化批量生产和精微细图形的制作与修复。
As surface mounting and the miniaturization and densification of electronic components have increased, the demand for the miniaturization of internal interconnection leads and the high quality and high performance have become increasingly stringent, and the traditional technologies are less and less able to meet such rapidly evolving needs. Using laser micro-cladding flexible direct write technology, directly on the glass substrate to prepare high-quality high-performance fine conduction band. By controlling the change of the process parameters caused by changes in the morphology to determine the performance of the conduction band to determine the quality of the merits and demerits to optimize the process parameters, and the use of the actual parameters of the graphic preparation. The results show that the prepared conductive tape has good conductivity, high bonding strength, good weldability and high surface flatness. It is suitable for the intelligent mass production of products and the fabrication and repair of fine patterns.