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以不锈钢为基底,利用电化学沉积方法制备Bi2Te3基薄膜材料,并采用X射线衍射技术、电子探针微观分析等方法对薄膜进行结构和成分表征,通过电化学阻抗谱技术对不锈钢表面Bi2Te3的电化学沉积机理进行了初步探讨.结果表明Bi-Te和Bi-Te-Se体系具有相似的电化学沉积机理,即Bi3+和2HTeO+或H2SeO3首先被还原为Bi单质和Te或Se单质,然后Bi单质与Te或Se单质反应生成Bi2Te3基化合物,而Bi-Sb-Te体系中,2HTeO+首先被还原为Te单质,生成的Te再与Bi3+和Sb(III)反应生成Bi2Te3基化合物,三种体系的沉积都受电化学极化控制.
Based on stainless steel, Bi2Te3-based thin films were prepared by electrochemical deposition. The structure and composition of the films were characterized by X-ray diffraction (XRD) and electron probe microanalysis. Electrochemical impedance spectroscopy The results show that the Bi-Te and Bi-Te-Se systems have similar electrochemical deposition mechanism, that is, Bi3 + and 2HTeO + or H2SeO3 are first reduced to Bi and Te or Se, and then the Bi and Te In the Bi-Sb-Te system, 2HTeO + is first reduced to the elemental Te, and the resulting Te reacts with Bi3 + and Sb (III) to form Bi2Te3-based compounds. The deposition of all three systems Electrochemical polarization control.