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(日本包装技术协会代表团于去年七月在沪进行技术交流时,我方向代表团成员和田亨提出了有关包装设计的若干问题。最近和田亨从东京来信,就有关提问提出一些看法,特译载如下。)
(When a delegation from Japan Packaging Technology Association held a technical exchange in Shanghai in July last year, I asked some questions about packaging design to He Tianheng, a member of the delegation and recently wrote a letter from Tokyo about his questions and suggestions Set as follows.)