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通过非等温DSC法及拉伸性能测试研究了4,4’-二氨基二苯基甲烷(DDM)用量对环氧树脂/聚酰胺651体系的固化反应的影响,计算了固化反应的表观活化能和反应级数,确定了其胶粘剂体系的固化工艺参数。结果表明,胶粘剂中DDM的质量分数达到14%(以环氧树脂质量为基准)时,固化反应放热量达到最大值。固化体系的活化能为53.654 kJ/mol,反应级数为0.895。最佳起始固化温度为40℃,峰值温度为85℃,终止温度为120℃,体系的拉伸强度提高了约50%。
The influence of the amount of 4,4’-diaminodiphenylmethane (DDM) on the curing reaction of epoxy resin / polyamide 651 system was studied by non-isothermal DSC and tensile properties test. The apparent activation of the curing reaction Energy and reaction series, to determine the adhesive system curing process parameters. The results show that when the mass fraction of DDM in the adhesive reaches 14% (based on the mass of the epoxy resin), the exothermic heat of curing reaches the maximum value. The activation energy of the curing system is 53.654 kJ / mol and the reaction order is 0.895. The optimum initial curing temperature is 40 ℃, the peak temperature is 85 ℃, the final temperature is 120 ℃, and the tensile strength of the system is increased by about 50%.