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SMT回流焊的炉温控制是电子产品质量的重要影响因素之一。传统PID控制技术下的回流焊炉温差较大,难以满足电子产品的焊接要求。本文设计了模糊PID控制器进行SMT回流焊炉温控制的研究,试验结果表明模糊PID控制下的回流焊工艺曲线与设定曲线的偏差在-2～2℃,温差绝对值的算术平均值为1.7℃,系统稳定性较好、控制精度较高,具有较高的工程应用价值。
SMT reflow oven temperature control is one of the important factors affecting the quality of electronic products. The traditional PID control technology, the reflow oven temperature difference is large, it is difficult to meet the welding requirements of electronic products. In this paper, a fuzzy PID controller is designed to study the SMT reflow temperature control. The experimental results show that the deviation between the reflow soldering process curve and the setting curve under the fuzzy PID control is between -2 and 2 ℃. The arithmetic average of the absolute temperature difference is 1.7 ℃, the system stability is better, the control precision is higher, and has higher engineering application value.