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半导体市场春燕提早飞来!受惠于明年2月农历春节旺季备货潮正式启动,包括台积电、联电等晶圆代工厂不仅12英寸厂利用率持续满载,8英寸厂也看到急单大举涌人,推升产能利用率达9成以上,且订单能见度直达明年第1季中旬。业者指出,除了PC生产链需求仍然疲弱,移动装置及消费性电子产品生产链拉货力道见到转强,库存调整几可确定提前结束,晶圆代工厂本季营收可望超标,平均季减率低于5%,明年第1季已无淡季效应,可望与本季持平或小跌,
Benefit from the Spring Festival in February next year, the peak season stocking tide officially started, including TSMC, UMC and other foundries not only 12-inch factory utilization continued to be full load, 8-inch plant also saw a surge in imminent rush , Pushing up production capacity utilization rate of 9% or more, and order visibility until mid-season next year. Industry pointed out that in addition to PC demand remains weak in the production chain, mobile devices and consumer electronics products to see the strength of the pull-up to see stronger inventory adjustments can be determined to end early, the foundry revenue this quarter is expected to exceed the standard, the average season With the reduction rate of less than 5%, there will be no off-season effect in the first quarter of next year, which is expected to be flat or slightly lower than the season.