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阐述一种新型的硅片自动定位方法,并介绍了其特点和具体的实现方法。此方法可适应不同规格晶片的定位要求,实用性强。
Describes a new type of silicon automatic positioning method, and describes its characteristics and specific methods of implementation. This method can adapt to different specifications of the wafer positioning requirements, practicality.