Surface Integrity of Ultrasonically-Assisted Milled Ti6Al4V Alloy Manufactured by Selective Laser Me

来源 :中国机械工程学报 | 被引量 : 0次 | 上传用户:jtls
下载到本地 , 更方便阅读
声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架
论文部分内容阅读
The Ti6Al4V parts produced by the existing selective laser melting (SLM) are mainly confronted with poor surface finish and inevitable interior defects,which substantially deteriorates the mechanical properties and performances of the parts.In this regard,ultrasonically-assisted machining (UAM) technique is commonly introduced to improve the machining quality due to its merits in increasing tool life and reducing cutting force.However,most of the previous studies focus on the performance of UAM with ultrasonic vibrations applied in the tangential and feed directions,whereas few of them on the impact of ultrasonic vibration along the vertical direction.In this study,the effects of feed rate on surface integrity in ultrasonically-assisted vertical milling (UAVM) of the Ti6Al4V alloy manufactured by SLM were systemically investigated compared with the conventional machining (CM) method.The results revealed that the milling forces in UAVM showed a lower amplitude than that in CM due to the intermittent cutting style.The surface roughness values of the parts produced by UAVM were generally greater than that by CM owing to the extra sinusoidal vibration textures induced by the milling cutter.Moreover,the extra vertical ultrasonic vibration in UAVM was beneficial to suppressing machining chatter.As feed rate increased,surface microhardness and thickness of the plastic deformation zone in CM raised due to more intensive plastic deformation,while these two material properties in UAVM were reduced owing to the mitigated impact effect by the high-frequency vibration of the milling cutter.Therefore,the improved surface microhardness and reduced thickness of the subsurface deformation layer in UAVM were ascribed to the vertical high-frequency impact of the milling cutter in UAVM In general,the results of this study provided an in-depth understanding in UAVM of Ti6Al4V parts manufactured by SLM.
其他文献
王省原名王育林,又名王超、王日省、王日三.湖北郧县人,1925年在私立武昌中华大学上学时加入中国共产党,投身学生运动,并参加了北伐策应工作.从武昌农讲所毕业后,成为襄樊地区工农运动的骨干,是1927年鄂北秋收起义的领导人之一,也是著名的宁都起义中央特派员、起义领导人之一.
期刊
1927年8月1日,在以周恩来为书记的中共中央前敌委员会的领导下,贺龙、叶挺、朱德、刘伯承等率领军队2万多人在南昌举行起义,并取得胜利.此后,南昌起义军按照中共中央在起义前的原定计划撤离南昌,绕路福建,进军广东.9月5日,起义军到达福建长汀后,周恩来主持召开了中共前敌委员会议,会上详细讨论了关于攻取广东东江的计划,并最终“主张以主力取潮汕,留一部分兵力于三河坝监视梅县之敌,再经揭阳出兴宁、五华取惠州”.[1]朱德率领第11军第25师及第9军军官教育团进驻大埔县三河坝,阻击尾追之敌,掩护主力南下.三河坝战役
期刊
王伟(1968-2001)男,汉族,中共党员,浙江湖州人,1986年6月入伍,生前系原南海舰队航空兵某团中队长,一级飞行员.2001年4月,在执行对美军电子侦察机跟踪监视飞行任务时,为保卫祖国领空,遭美机撞击被迫跳伞坠海壮烈牺牲,被中央军委追授“海空卫士”荣誉称号.2019年9月,被表彰为“最美奋斗者”.这是王伟写给妻子阮国琴的信.
期刊
二战及以前,美国主要是通过发动战争、殖民统治、经济交换等手段获取海外军事基地,到二战结束时,美国海外军事基地遍布全球,总数达2000多个,含军事设施3万余处.[1]但二战刚结束的几年内,美国海外军事基地快速收缩.与战时获取基地的短期性和不稳定性相比,二战后,美国普遍采用签署基地协定、部队地位协定(Status of Force Agreement,SOFA)或安全合作条约等双边或多边条约、协定的形式来确定海外军事基地及驻军的法律地位.这为规范海外基地设立及海外驻军行为提供了法律基础,对维护世界和平起到了一
期刊
在维护国家领土主权的边防斗争中,我边防部队敢于斗争、敢于胜利,坚决反击非法越线侵权挑衅行径,取得重大胜利,涌现出新时代卫国戍边英雄群体.祁发宝身先士卒,身负重伤,陈红军、陈祥榕、肖思远毫不畏惧、英勇战斗,直至壮烈牺牲,王焯冉在渡河前出支援途中,为救助战友牺牲.他们以誓死捍卫祖国领土的赤胆忠诚和一不怕苦、二不怕死的战斗精神,践行了“大好河山、寸土不让”的铿锵誓言.他们是新时代卫国戍边英雄群体,是“四有”新时代革命军人的杰出代表,是对党绝对忠诚、矢志强军报国的时代先锋.
期刊
2008年5月12日,四川汶川发生里氏8.0级特大地震.危急时刻,14.6万名人民子弟兵紧急奔赴灾区,冒死挺进震中,争分夺秒从废墟中拯救生命,只要有一线希望,就要付出百倍努力,为受灾群众送去党的关怀和温暖,谱写了与人民群众团结一心、共克时艰的感人篇章.这些是抗震救灾时期,人民解放军写下的请战书和入党申请书.
期刊
坚决打赢疫情防控人民战争、总体战、阻击战.统帅一声号令,人民军队迅疾行动,4000多医务人员驰援武汉.任务完成,悄然撤离.全体人员牢记我军宗旨,始终坚持人民利益高于一切,把人民群众生命安全和身体健康放在第一位,展现了人民子弟兵忠于党、忠于人民的政治品格,锤炼了我军能打仗、打胜仗的过硬本领,彰显了我军越是艰险越向前的大无畏革命精神,为党旗、军旗增添了光彩.这是抗疫一线官兵的决心书、请战书、家书和入党申请书.
期刊
朱德南昌起义时使用的驳壳枪rn朱德在南昌起义时使用的德国造M1896式警用短管毛瑟手枪,口径7.63mm、长26.3cm、枪管长10cm,一级文物.rn大革命失败后,中共中央决定发动南昌起义,成立了以周恩来为书记的前敌委员会.朱德因对江西情况熟悉,奉命返回南昌为起义做准备.朱德按照事先安排在佳宾楼摆下宴席款待南昌驻军的两个团长,吃完饭又拉着他们打牌.
期刊
Lithium-ion batteries have always been a focus of research on new energy vehicles,however,their internal reactions are complex,and problems such as battery aging and safety have not been fully understood.In view of the research and preliminary application
Compliant micromechanisms (CMMs) acquire mobility from the deflection of elastic members and have been proven to be robust by millions of silicon MEMS devices.However,the limited deflection of silicon impedes the realization of more sophisticated CMMs,whi