论文部分内容阅读
采用扩散焊接工艺制备铜/钨铜/铜热沉复合材料,研究了焊接温度、保温时间、焊接压强对焊接界面结合强度和界面扩散的影响,当焊接温度为980℃、保温时间为4h、压强为55MPa时,铜/钨铜/铜热沉复合材料的界面结合强度最大,说明此时扩散复合的效果最好,焊接接头质量最高。
The effects of welding temperature, holding time and welding pressure on the bonding strength and interfacial diffusion of the welding interface were studied. The results showed that when the welding temperature was 980 ℃, the holding time was 4h, the pressure At 55MPa, the interface bonding strength of copper / tungsten-copper / copper heat sink composites is the highest, which shows that diffusion composites have the best effect and welded joints have the highest quality.