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电沉积Ａｌ２Ｏ３／Ｃｕ 复合镀层的光镜及ＳＥＭ 分析结果表明，复合镀层的组织结构受极板放置方式、电流密度和施镀时间的影响；电沉积初期以平面生长和螺旋生长两种方式进行，并以平面生长为主，形成胞状形态；沉积后期转向基体金属的择尤生长，形成脊状生长形态。
Electrodeposition of Al2O3 / Cu composite coating by light microscopy and SEM analysis showed that the structure of the composite coating by the electrode plate placement, current density and plating time; early electrodeposition growth by plane and helical growth in two ways, And the main growth in the plane, the formation of cellular morphology; late deposition to the matrix metal especially in the growth, the formation of ridge growth patterns.