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一、会议概况第二届国际模态分析会议在美国佛罗里达州奥兰多市举行,会议为期四天,自1984年2月6日至9日.本次会议由纽约Schenectady联合学院发起,得到通用电气公司的赞助.参加会议交流的论文总计为159篇,全部收入论文集并刊印成上下册.这159篇论文是由23个国家的271名作者提供(所列数字系根据会议程序表统计).出席会议人数估计近600人,除论文作者外,还包括三百余名对会议有兴趣者.中国出席本次会议的人数为10名,包括教育部三人、中汽公司二人、计量院一人,访问学者一人以及台湾地区三人.除开幕式和“模态分析的未来方向”讨论会在主会场进行外,会议论文划分为37个小组分6个分会场同时
I. Overview of the conference The second International Modal Analysis Conference was held in Orlando, Florida, USA. The conference lasted for four days from February 6 to 9, 1984. The conference was initiated by the Schenectady United College in New York and obtained general electric company. The sponsorships. The number of papers participating in the conference exchange was 159, and all the income collections were published and printed in two volumes. These 159 papers were provided by 271 authors from 23 countries (the figures listed are based on the schedule of meetings). The number of participants was estimated to be nearly 600. Apart from the authors of the papers, more than 300 people interested in the conference were also included. The number of people attending the conference was 10, including three from the Ministry of Education, two from the China Automobile Corporation, and one from the metrology institute. , One visiting scholar and three Taiwanese. Except for the opening ceremony and the “Future Direction of Modal Analysis” seminar held at the main venue, the conference paper was divided into 37 sub-groups and 6 sub-venues.