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用脉冲电沉积技术制备Ni镀层,研究了脉冲周期和糖精添加剂对其微观结构的影响。结果表明,采用单向脉冲电沉积时,增大脉冲周期可制备出生长取向更均匀、表面更平整且晶粒尺寸更小的纳米晶Ni镀层;在镀液中加入糖精可降低镀层中的张应力,从而避免镀层开裂,且可明显细化镀层的晶粒尺寸;采用正反脉冲电沉积时,随着反向脉冲周期的增大,镀层的晶粒先沿〈200〉方向择优生长,而后转变为沿〈111〉、〈200〉和〈220〉三个方向较均匀生长,最后又重新沿〈200〉方向择优生长。
Ni plating was prepared by pulsed electrodeposition and the influence of pulse period and saccharin additive on its microstructure was studied. The results show that the nanocrystalline Ni coating with more uniform growth orientation and smoother surface and smaller grain size can be prepared by increasing the pulse period by using one-way pulsed electrodeposition. Adding saccharin to the plating solution can reduce the tension of the coating Stress, so as to avoid coating cracking, and can significantly refine the grain size of the coating; using positive and negative pulse electrodeposition, with the reverse pulse cycle increases, the coating grain preferentially grows along the <200> direction, and then It transforms into more uniform growth in the three directions of <111>, <200> and <220>, and finally re-grows along the <200> direction.