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2000年4月在第一部分讨论了苯基咪唑OSP(Organic Solderability Preservative——有机可焊性保护层)工艺。第二部分讨论该工艺的实现。挠性印制电路(图1)与典型的刚性板要求在设计和制造上有着明显的不同。当通过OSP生产线处理挠性电路时,这些差别就会
April 2000 in the first part of the phenylimidazole OSP (Organic Solderability Preservative - organic solderability protection layer) process. The second part discusses the realization of the process. Flexible printed circuit (Figure 1) and the typical rigid board requirements in the design and manufacture of a significant difference. These differences will occur when handling flex circuits through the OSP line