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引言1980年5月28～30在日本召开了为期三天的国际微电子学会议(IMC 1980),专门讨论了“混合技术”问题。认为在电子设备向多功能,复杂化,小形、轻量化发展的进程中,混合微电子学技术的重要性日益提高。当前正在冲出混合集成电路(HIC)的狭隘框框,确立包括半导体集成电路(IC)在内的电子设备的组装、制造技术的基本手段,以及集成化组装技术体系,为今后的技术发展拉开了新的一幕。《电子材料》期刊,1980年第5期为此出版了特
INTRODUCTION The three-day International Microelectronics Conference (IMC 1980) was held in Japan from 28 to 30 May 1980, devoted to the issue of “hybrid technologies.” It is considered that the importance of hybrid microelectronics technology is increasing in the process of multi-functional, complicated, compact and lightweight electronic devices. At present, the narrow frame of hybrid integrated circuits (HICs) is being popularized, and the basic means for assembling and manufacturing electronic devices including semiconductor integrated circuits (ICs), as well as the integrated assembly technology system, are being opened up for the future technological development A new scene “Electronic Materials” issue, No. 5, 1980, published for this purpose