NH3 Plasma Surface Treatments of Engineering Fluoropolymers： A Way to Enhance Adhesion of Ni or Cu T

• 作 者: MauriceRomand MarleneCharbonni
• 机 构: LaboratoiredeSciencesetIngenieriedesSurfacesUniversiteClaudeBernard-yon1,UMR5180desSciencesAnalytiqu
• 出 处: 材料热处理学报
• 发表日期: 2004年05B期
• 关键词: 镍化学镀层 铜化学镀层 等离子表面处理 表面催化 XPS 剥离试验 Ni electroless plating Cu electroless plating

This paper describes the electroless Ni or Cu plating of some fiuoropolymer substrates through a tin-free activation process. Materials subjected to surface metallization are commercial Teflon() FEP, Nafion(), ACLAR() and LaRCTM-CP1 thin films which have