Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder a

• 作 者: 赵国际 文光华 盛光敏 景彦霞
• 机 构: CollegeofMaterialsScienceandEngineering,ChongqingIndustryPolytechnicCollege
• 出 处: Journal of Central South University
• 发表日期: 2016年8期
• 关键词: SN-9ZN 力学特性分析 快速凝固 钎料合金 铜接头 ND 界面性能 焊料合金 rapid solidification Sn-Zn-RE solder

Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn sol