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减少印刷电路板(PCB)耦合微带线间的串扰是发展高速高密度PCB必须研究解决的问题。在满足端接匹配的条件下,建立了PCB耦合微带线间串扰测试的结构。通过有限元分析和实验测试,研究了在PCB微带线之间未加防护带和添加防护带对微带线间串扰的影响,考察了微带线间串扰对防护带的宽度和接地孔间距的依赖性。数值分析和实验结果皆表明,为了获得减少PCB微带线间串扰的最佳效果,防护带的宽度存在一个最佳值,使用此最佳值,近端串扰峰值衰减要比没有防护带时多9 dB,远端串扰峰值衰减多7 dB。同时防护带上密布的接地孔间距必须满足一个临界条件。
Reducing crosstalk between printed circuit board (PCB) coupled microstrip lines is a problem that must be addressed to develop a high-speed, high-density PCB. Under the condition of meeting the termination matching, the structure of the PCB coupling microstrip crosstalk test was established. Through the finite element analysis and experimental testing, the influence of no guard band and added guard band on the crosstalk between the microstrip lines between the PCB microstrip lines was studied. The effects of crosstalk between the microstrip lines on the width of the guard band and the distance between the ground holes Dependency. Numerical analysis and experimental results show that in order to obtain the best effect of reducing PCB crosstalk between microstrip lines, there is an optimum width of the guard band. With this optimal value, the peak attenuation of near-end crosstalk is more than that without guard band 9 dB, far-end crosstalk peak attenuation of 7 dB. At the same time, the distance between the grounded grounding holes on the protective tape must meet a critical condition.