论文部分内容阅读
本文概述了Cu-Ni-Zn台金系的发展；分析了合金Spirmdal分解的特点；简述了合金的试验方法；研究和讨论了固溶温度、加工强化、时效规范、高温电阻和温度系数及钆(Gd)对合金的性能和结构的影响；简介了合金的试用情况。研究结果表明,合金具有高的硬度、强度和弹性、良好的抗疲劳及应力松驰能力、耐蚀性、耐磨性、优良的钎焊性和工艺性、热处理的简便性以及经济而无毒等优点。Gd的加入改变了合金Spinodal亚稳分解物的形态、大小、数量和分布,提高了合金的性能。两种合金的物理——机械性能如下：经有关单位试用表明：CuNi15Sn8Gd0．5合金用于250℃高温波段开关,具有优良的高温力学性能,低而稳定的接触电阻。将上述合金作为200℃内用继电器复合接点簧片的基体,综合性能超过了Ag／QBe2复合材料,更优于Ag-Mg-Ni,具有长寿命、耐高温、高可靠和节约Ag50％等优点。将CuNi15Sn8Gd0．5合金用作电子管管座,以代CuBe2材料,具有优良的使用性能,是代铍铜的新材料。它们可应用于继电器、电位器、开关、接插件等接触簧片和仪器仪表中的弹性元件等。
This paper summarizes the development of Cu-Ni-Zn ternary system, analyzes the characteristics of alloy Spirmdal decomposition, briefly describes the experimental methods of alloy, studies and discusses the effects of solution temperature, strengthening process, aging regulation, high temperature resistance and temperature coefficient and Effect of Gd on the properties and structure of the alloy; Brief introduction to the experimental conditions of the alloy. The results show that the alloy has high hardness, strength and elasticity, good resistance to fatigue and stress relaxation, corrosion resistance, wear resistance, excellent brazing and processability, ease of heat treatment and economical and non-toxic Etc. The addition of Gd changed the morphology, size, amount and distribution of the alloy Spinodal metastables, improving the properties of the alloy. The physical and mechanical properties of the two alloys are as follows: The trial by the relevant units show that: CuNi15Sn8Gd0.5 alloy for 250 ℃ high temperature band switch, with excellent high temperature mechanical properties, low and stable contact resistance. The above-mentioned alloy is used as a base of a composite reed with a relay within 200 DEG C, which has better comprehensive performance than the Ag / QBe2 composite material and is superior to Ag-Mg-Ni, has the advantages of long life, high temperature resistance, high reliability, and saving Ag50% . The CuNi15Sn8Gd0.5 alloy used as a tube seat tube, on behalf of CuBe2 material, has excellent performance, is the new material on behalf of beryllium copper. They can be applied to relays, potentiometers, switches, connectors and other contact springs and instrumentation in the elastic components.