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偶联剂处理纳米二氧化硅(nano-SiO2)填充氰酸酯(BCE)/双马来酰亚胺的预聚体(BMI)体系制备出nano-SiO2/BCE/BMI复合材料,对比考察不同硅烷偶联剂处理的nano-SiO2对nano-SiO2/BCE/BMI复合材料的耐热性能、力学性能和介电性能的影响,并通过扫描电镜分析增韧机理。结果表明:偶联剂处理的nano-SiO2可提高nano-SiO2/BCE/BMI复合材料的冲击强度和热分解温度,尤以偶联剂KH560处理的效果最好,与未处理的相比冲击强度和热分解温分别提高了25.2%和9.6%,同时偶联剂KH-560处理的nano-SiO2/BCE/BMI复合材料的介电常数和介质损耗角正切值在1～40 MHz范围内都明显低于于不处理的nano-SiO2/BCE/BMI复合材料。
The nano-SiO2 / BCE / BMI composite was prepared by coupling agent-treated nano-SiO2 filled BCE / BMI system. Silane coupling agent treated nano-SiO2 nano-SiO2 / BCE / BMI composites heat resistance, mechanical properties and dielectric properties, and toughening mechanism analysis by scanning electron microscopy. The results showed that nano-SiO2 treated with coupling agent can improve the impact strength and thermal decomposition temperature of nano-SiO2 / BCE / BMI composites, especially the KH560 with the best coupling strength. Compared with the untreated, the impact strength And the thermal decomposition temperature increased by 25.2% and 9.6%, respectively. Meanwhile, the dielectric constant and dielectric loss tangent value of nano-SiO2 / BCE / BMI composites treated by the coupling agent KH-560 were all in the range of 1 ~ 40 MHz Lower than the untreated nano-SiO2 / BCE / BMI composites.