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IBM 公司研制了一种试验性的电镀技术,这种技术是采用激光器的热量来强化在小面积上金属的淀积,从而能制作小的金属图形。据报导,这种方法不需要一般光刻制作方法中所使用的掩模。新技术是将钼、钨或镍之类的阴极材料预先淀积在玻璃之类的透明衬底上,厚度大约0.1_微米。阳极可以是白金或在电镀工艺中化学性能不活泼的金属、或者是被淀积的金属材料。将镀在透明衬底上的阳极和阴极置于电镀液中。对于可
IBM has developed an experimental electroplating technique that uses laser heat to enhance the deposition of metal on a small area so that small metal patterns can be made. It has been reported that this method does not require the mask used in the general photolithography process. New technology is the cathode material such as molybdenum, tungsten or nickel pre-deposited on glass and the like transparent substrate, the thickness of about 0.1_micron. The anode can be platinum or a metal that is not chemically active in the plating process, or a deposited metal material. The anode and the cathode plated on the transparent substrate are placed in the plating solution. For yes