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印刷电路板的激光焊接有许多优点:热只加到(?)待焊焊点上,而不象通常大规模焊接那样加到整块板和所有元件上。由于只有焊点被加热,可避免外壳和内部集成电路的损坏,也可消除下部混合电路元件内连接的危险。由于激光焊接速度一一每焊点高达500ms,激光焊接使焊剂中的易碎内金属化合物形成降至最低限度。最后,由于焊点是逐个加热的,激光也可使导
Laser welding of printed circuit boards has many advantages: Heat is applied only to the solder joints to be soldered, rather than to the entire board and to all components, as is the case with typical large-scale soldering. Since only the solder joints are heated, damage to the housing and internal integrated circuits can be avoided and the risk of connections within the lower mixed-circuit components can be eliminated. Laser welding minimizes the formation of fragile internal metal compounds in flux due to the laser welding speed of up to 500ms per spot. Finally, because the solder joints are heated one by one, the laser can also guide it