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采用稀土多元扩渗的方法,通过高温热解硼钨杂多配合物制备了共生型(ITB)钨青铜。对产物结构进行了XRD、XPS、TG-DTA表征,同时研究了温度对共生型钨青铜的导电性能的影响。结果表明,共生型钨青铜电导率随温度变化呈现一定规律:从室温(300K左右)到500K左右,电导率随温度变化不大,从525K开始电导率有个突增阶段,在600~625K左右达到最大值。在前躯体是硼钨钆的情况下,混合稀土扩渗得到的钨青铜室温电导率为1.05×10-2S.cm-1,产物在500℃以下具有较好的热稳定性。
The symbiotic (ITB) tungsten bronze was prepared by high-temperature pyrolysis of heteropoly-boro-tungsten complex by rare-earth multiple diffusion. The product structure was characterized by XRD, XPS and TG-DTA. The influence of temperature on the electrical conductivity of the symbiotic tungsten bronze was also studied. The results show that the conductivity of symbiotic tungsten bronze shows a certain rule with temperature: from room temperature (about 300K) to about 500K, the conductivity changes little with temperature. From 525K, the conductivity has an increasing phase at 600 ~ 625K Reaches the maximum value. When the precursor is boron-gadolinium-gadolinium, the room-temperature conductivity of the tungsten bronze obtained by the mischmetal mixing is 1.05 × 10 -2 S · cm -1, and the product has better thermal stability under 500 ° C.