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覆铜箔层压板（简称覆箔板）是制造印制电路板的主要材料，印制电路又是当代电子技术的支柱之一．所以覆箔板就构成了电子工业的重要基础材料，从生产行业上看，它也是绝缘材料里一个重要分支．它是以绝缘层压板为基材与铜箔粘合而成的复合材和这种材料在我国从50年代末开始研
Copper clad laminates (referred to as clad foils) are the main materials for the manufacture of printed circuit boards. Printed circuits are one of the pillars of contemporary electronic technology. Therefore, the foil-clad board constitutes an important basic material for the electronics industry. From the perspective of the production industry, it is also an important branch of the insulating material. It is a composite material made of an insulating laminate substrate and a copper foil and this material has been developed in China since the late 1950s.